SK Hynix Adopts Intel EMIB Packaging to Build 3D High-Bandwidth Memory
Sourced from 3 publications
- •SK Hynix is using Intel's EMIB packaging technology for its next-generation HBM memory products, per Wccftech.
- •The company is targeting 3D packaging structures for future HBM generations to increase bandwidth and density.
- •Taiwan-based Jeilin is shifting toward higher-end image-processing SoCs, boosting margins in camera and drone markets, according to Digitimes.
- •SK Hynix's cross-licensing from Intel highlights growing interdependence among chipmakers in advanced packaging.
Sources
Jeilin shifts upmarket as high-end image SoCs drive margins higher
Digitimes
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Wccftech
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Curated from 3 sources. Every summary is reviewed for accuracy, but may still contain errors. We always link to original sources for verification.
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